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Lithium Batteries

IGBT Application

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Front Side Metallization Process

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Back Side Metallization Process

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IGBT Wafer Backend Process

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Maximizing the value of power semiconductor, devoting to the environmental sustainability.

TECH LIBRARY

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New Challenge in 1.5 Mil Taiko Wafer with High Wafer Strength

「Power semiconductor is the hot topic now and is a future trend which, in turn, forced us to face and deal with the process risks that ...
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Sputtering Deposition V.S. Electro-less Plating: Two Options for MOSFET FSM

「 Why is FSM needed? Why is FSM needed only for some wafers? Which two options are available for FSM? 」 1. Why is FSM needed? F...
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PRESS ROOM

ProPowertek makes a breakthrough in 1.5 Mil Taiko Wafer with High Wafer Strength
2021-01-06

With the booming development of 5G, IoT and electric vehicles, the requirements for low power consumption are getting more and more dem...
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