Chemical/Electro-less Plating

Chemical/Electro-less Plating The Chemical / Electro-less Plating process reduces metal ions into metal with a chemical / electro-less plating solution in a reaction tank and deposits them on the wafer surface via a redox reaction.

What ProPowertek can do for you?

The Chemical / Electro-less Plating provided by ProPowertek enables customers to add a metal layer on Al pads, e.g. Electro-less Nickle Electro-less Palladium Immersion Gold (ENEPIG) or Electro-less Nickle Immersion Gold (ENIG) instead of defining a soldering pad pattern by photolithography.

Electro-less Plating Process

Wafers provided by the customer shall be fed into electro-less plating for metal deposits according to given types and thicknesses after IQC (Incoming Quality Control). Pre-loaded programs in the electro-less plating machine shall follow the following steps: 1. Auto degrease wafers before micro-etching the aluminum pad (Al Pad). 2. Execute zincation procedure twice: execute the first zincation followed by zinc micro-etching and then execute zincation again afterward. 3. Execute electro-less plating of ENEPIG with Ni/Pd/Au before OQC(Outgoing Quality Control).

 	Electro-less Plating Process

The Superiority of ProPowertek

  • In addition to providing ENIG service, ProPowertek can also provide ENEPIG as required by the customer.
  • We provide secondary zincation to ensure that the surface roughness can meet the growth requirements.
  • Customize the pre-treatment program to get good plating quality for our clients even under various conditions of front-end foundries.
  • Reduce production time by removing the photolithography/etching/sputtering operations
  • An unique engineering services company providing electro-less plating and BGBM integrated processes in Taiwan
  • A team of engineers with diversified experts including front end wafer foundry, wafer thinning and backend packaging house, knowledgeable and experienced in process integration and analysis in phases from front through middle to back and well-prepared to assist customers in accelerated development, troubleshooting, and mass production stabilization.

 

Case Sharing

Electro-less Plating Deposits

Electro-less Plating Deposits

Deposit ENEPIG with electro-less plating on Al Pad surface without big losses

Application

  • Existing metal options: Ni/Pd/Au (ENEPIG) and Ni/Au (ENIG) with thickness subject to customer requirements
  • Applicable to 8"/6" wafers
  • Applicable to Al, AlCu, AlSiCu, AlSi Pad

Mr. Hsieh / Felipe
Tel: +886-3-579-9209#5802
email: contact@propowertek.com

Send us a message

Hi, if you have any inquiries or suggestions, please call us on +886-3-579-9209 or use the below form to leave your message. We will respond as promptly as we can.