Taiko Grinding Total Solution
By using grinding wheel, grind wafers close to the edge and leave the edge remain intact. This makes wafers with edges similar to the frame of a Taiko drum (and so the name of Taiko Grinding). This greatly reduces warpage suffered by extremely thin wafers. Then remove the damage layer caused by grinding.What ProPowertek can do for you?
The ProPowertek provides customers with extremely thin wafers up to 50um with its Taiko grinding technique, and also offers spin etching service to remove the damaged layer caused by grinding. Moreover, an one-stop backend packaging service such as Vacuum Mount and Taiko Ring Removal is provided, which enables wafers that thinner than the diameter of human hair to be safely transported to the next station.
Taiko Grinding Process
Tape wafers with the specified tapes determined by customer’s wafer features and the requirements of the passivation layers produced by front end foundries; then perform Pre-Grinding, Taiko Grinding, and Backside Wet Etching in sequence; finally, perform non-contact thickness and Taiko ring width and thickness measurement before OQC.
The Superiority of ProPowertek
- Employ fully automatic DISCO equipment for Pre-grinding, Taiko Grinding, Taiko Ring Removal for precisely controlled grinding; single-piece etching machine available for process for N- or P-type wafers as required by customers.
- Provide non-contact optical measurement for precision thickness, Taiko ring width and thickness which far outperforms the dial gauge widely adopted by the industry with and high precision measurement.
- A team of engineers with diversified experts including front end wafer foundry, wafer thinning and backend packaging house, knowledgeable and experienced in process integration and analysis in phases from front through middle to back and well-prepared to assist customers in accelerated development, troubleshooting, and mass production stabilization.
Case Sharing
Taiko Ring
Post-grinding wafers
Post-etching wafers
Wafer with Taiko ring removed
Application
- Existing thickness options: 50~100um in mass production now, with thickness adjusted subject to customer requirements; 37.5um has been developed, and a few customers are in production testing ,25um thickness is in development, development and verification subject to customer requirements.
- Applicable to 8"/6" P- or N-type wafers
