DR-MOS-the best actor of balanced energy and high performance

Amid the trend of pursuing compact electronic components,
the DR-MOS technology integrates three independent components into one unit to enjoy the benefits of compactness as well as improved performance of electricity and products.

3-in-1 energy saving component: DR-MOS

Doctor MOS, also named DR-MOS, is an energy saving technology that integrates an independent driver IC, High Side MOS, and Low Side MOS into one highly integrated unit by Quad Flat Non-leaded package (QFN) technique.
Thanks to technology development and soaring demands on power consumption by CPU/GPU, DR-MOS is outperforming its independent counterparts with falling parasitic capacitance, inductance, switch losses and much better efficiency.
Structure of DR-MOS
Figure 1: Structure of DR-MOS

DR-MOS: Power Saving And Overclocking

Conventional CPU/GPU power supplies convert high frequency electricity by feeding drivers with pulses generated by Pulse Width Modulation (PWM) to control the High side/Low side MOSFET switch as shown in figure 1. The conventional approach employs three independent ICs (Driver, high side MOSFET, low side MOSFET) scattered on a mainboard to perform this function. Suffering a very long signal communication route among them, the operation frequency has to be kept in the range of 200KHz–400KHz. In case of operations requiring environments of higher frequency, the CPU/GPU may end up without adequate dynamic current.

 

DR-MOS packages Driver, High side MOSFET, and Low side MOSFET in one QFN to shorten the communication path for control signals. This raises operation frequency in the range of 550KHz–850KHz to give the CPU/GPU adequate dynamic current.
The DR-MOS-based mainboards that come with lower temperature and resistance as well as better efficiency and lower power consumption. In addition, the mainboard also benefits with better overclocking performance due to ultra-low power response time and low impedance features by DR-MOS.
DR-MOS technology is mostly adopted by applications in CPU/GPU power supply and products requiring high frequency operations including servers, database, and 5G.

 

Conventional VS DR-MOS structure

Figure 2: Conventional VS DR-MOS structure

 

Propowertek is Building Up One-Stop Thinning Supply Chain to Offer 3-In-1 Dr. MOS Components

Thanks to continuous efforts in minimizing components and maximizing integration of components by all IC suppliers, DR-MOS products are now the focus of development by each IC manufacturer. With highly advanced Front Side Metallization (FSM), ProPowertek is replacing end metal Al with Ag or Au, and its mature thinning technology is ready for mass production of 50um Taiko process and small quantities to customers for 37.5um products' engineering verification.

The one-stop integrated services for back-end process of wafer making by ProPowertek, from Taiko thinning process, back side gold filming, chip probing, vacuum mount, Taiko ring removal, die sawing, through to tape & reel, are providing customers with a complete thinning supply chain.

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