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“After passing the WAT (Wafer Acceptance Test) in the front end wafer foundry. How to handle the wafer thinning and back side metallization before assembly?“
“Finally wafer thinning and back side metallization were finished, but you need to transport wafer to another suppliers for CP and sawing with high risk, is there any place to do it right one time?“
ProPowertek has recruited professional experts and implement advanced processing to assist you in completing wafer thinning and back side metallization in short time.
⏺︎ Various solutions for surface grinding process
⏺︎ Various solutions for backside metallization
⏺︎ Backside silver thickness to 15um (even can be customized up to 40um) and various solutions for front side metallization
⏺︎ A complete and extensive one-stop service
Service Features
⏺︎ One-Stop Service
Front Side Metallization Process
Back Side Grinding Process
Back Side Metallization Process
IGBT Wafer Backend Process
⏺︎ Other Services
Turnkey Solution for Backend Process
Semiconductor Manufacturing Process
ProPowertek is capable to provide one-stop MOSFET backend solution including WLCSP, CP and DPS in cooperation with its subsidiary, ITS (see the blue and pink highlight for ProPowertek & ITS services).
Service Items
⏺︎ Front Side Metallization Process
Chemical / Electro-less Plating
Metal Sputtering Deposition
⏺︎ Back Side Grinding Process
Taiko Grinding Total Solution
Wafer thinning/Non-Taiko Grinding/Conventional Grinding
⏺︎ Back Side Metallization Process
Metal Evaporation
Thick Ag Process
Back Side Metal Sputtering Deposition
⏺︎ IGBT Wafer Backend Process
IGBT Back Side Metal Sputtering
Deposition
Backside Implantation
Laser Annealing
⏺︎ Auto Optical Inspection
Wafer AOI inspection
⏺︎ Wafer Dicing Process
Blade Dicing Process
Laser Dicing Process
⏺︎ Wafer Sort Test Process
Wafer Testing Process
Test Platform
